Business fields

MEMS micro system device manufacturing

Micro-electromechanical system (MEMS) technology is a cutting-edge technology in the 21st century based on nano/micron technology. It refers to the technology of designing, processing, manufacturing, measuring and controlling nano/micron materials.

Products based on semiconductor materials and processes, micro-nano, micro-electronics, optics and micro-mechanical technology in one, is a leading international level of new generation of scientific and technological products, in the military defense and civil areas have a wide range of applications, is the basic industry of the Internet of Things.

Qixin as the research and transformation base of Zibo MEMS in Tsinghua University, introduces the core technology products and technology which represent the future direction, and has the core independent intellectual property rights of the micro-system technology products - micro-mechanical gyroscope, micro-mechanical relay, micro-mechanical capacitance and so on.

Enterprises have the highest level of domestic research results can be converted into the ability to build the only domestic industrial base of MEMS products.

IC packaging products

We're the leading enterprise in package testing of chips in china.

We have capability to package and test various chips. Products are widely used in Telecom, identification, logistics, banking, transport, and other fields.

The main products of the company are contact IC chip module, contactless IC chip module, double interface IC card chip module, electronic label and so on.

New business fields

By using Micro nano technology to rewire on the surface of wafers, minimizing the size of chip devices and stacking multiple chips is an important way to meet the requirements of miniaturization,micro miniaturization,low power consumption, and optimal heat dissipation of semiconductor devices.The project adopts an emerging high-end semiconductor packaging technology that integrates internationally advanced Chip Scale Package(CSP) and Wafer Level Packaging (WLP),and the products are widely used in Mobile Communication Chips , Automotive Electronics Chips , Image Sensing Chips , Environmental Phototonus Chips , Medical Electronic Devices , MEMS Chips , Biometric Identification Chips , LED Chips , Radio Frequency Chips , Power IC Chips and other relevant products , it have broad application prospects .

By using Micro nano technology to rewire on the surface of wafers, minimizing the size of chip devices and stacking multiple chips is an important way to meet the requirements of miniaturization,micro miniaturization,low power consumption, and optimal heat dissipation of semiconductor devices.The project adopts an emerging high-end semiconductor packaging technology that integrates internationally advanced Chip Scale Package(CSP) and Wafer Level Packaging (WLP),and the products are widely used in Mobile Communication Chips , Automotive Electronics Chips , Image Sensing Chips , Environmental Phototonus Chips , Medical Electronic Devices , MEMS Chips , Biometric Identification Chips , LED Chips , Radio Frequency Chips , Power IC Chips and other relevant products , it have broad application prospects .